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  • Electronic silicon gel
  • Electronic silicon gel
  • Electronic silicon gel
  • Electronic silicon gel
  • Electronic silicon gel
  • Electronic silicon gel
  • Electronic silicon gel
  • Electronic silicon gel
Electronic silicon gel
Name:Electronic silicon gel
Model:DML2131-556

This silicon gel is a fluidless silicon material that is room temperature, or can be heated. Composed of AB dual fluid, there is highlighted adhesion performance, so moisture-proof is extremely good; and is extremely soft, easy to reduce mechanical stress and tension caused by mechanical, hot and hot impact and vibration. The shape is like jelly, the surface has viscous, high transparent, and the thickness limit can clearly see the potted electronic components; while insulation, excellent electrical performance, low stress, no solvent in the product, no cure by-products, Excellent materials for electronic products under stringent conditions.


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product description
Electronic silicone gel is a silicone potting adhesive that is adhesive after curing, has good elasticity, good toughness, so that self-repair ability, automatic healing after the external force is fed, restored to the originality of the same system; Compared with the addition, it is good to adaptive, resulting in highlighting waterproof moisture-proof performance, is an excellent potting rubber material, which is favored by many customers who seek domestic alternatives, the lack of DC527, WACK 612, Map 3062 and so on.

If you still have questions when you pass through the end, please click the two-dimensional code to find the small video of the silicone gel, and can see the whole picture of the silicone gel.

parameter parametric

state status

Test items

unit

parameter parametric

Remark remark

Before curing

color


Transparent transparent

A component

Transparent transparent

B component

Viscosity

25oC, MPA S


A component


B component

density

25ºC,g/cm3

0.98 ± 0.05

A component

0.98 ± 0.05

B component

The mixing ratio


1: 1

Operating time

25ºC RH 50%, min


Adjustable

Curing time

25ºC RH 50%, HR


60ºC,Hr


After curing

color


Transparent gel

After mixing

Thermal Conductivity

w/m·k


Coefficient of expansion coefficient of dilatation

μm / (m, ºC)

≦ 200

Elongation at break



Dielectric strength

Kv/mm(25ºC)


Volume resistance

(DC500V), O. CM

1.0 × 1015

Instructions

Mix

The product is provided in a two-component form to mix the A component with the B component with a predetermined weight ratio. After a component is thoroughly mixed with B components, gently agitate to reduce the amount of air mixed. Vacuum sputum treatment before perfusion can reach the most ideal rolled state.

 

2. Applicable period / operation time

The curing reaction starts at the beginning of the mixing process. The initial curing phenomenon is gradually increased, and then the gel is started, and then transformed into an elastomer. The definition of the applicable period is that the viscosity increases to the original twice as component A and B (mains and curing agents).

 

3. Processing and Curing

After the product is fully mixed, it can be directly injected / dispensing to a component that requires curing, and the components should be vacuum-deprived after using the product pot. The product can be cured either at room temperature (25 ° C) or heated.

 

4. Compatibility

In some cases, this product will not be able to achieve the most desirable curing effect when contacting some plastic or rubber, and the surface of the solvent is cleaned or baked with a slight baked above the curing temperature can be resolved.

Some chemicals can inhibit curing, and the following materials should pay special attention: an organic substance containing N, P, S, and an ionic compound containing Sn, Pb, Hg, Bi, AS or the like; compounds containing hydrine and polyalkyl groups; condensation Types and their contaminated molds and tools.
 

5. Repairability

When producing electrical / electronic equipment, it is desirable to recover waste or damaged products. It is difficult or impossible to remove and reperfuse the non-organic silicon rigid potting material without significant damage to the internal circuit. The use of Di Moni silicone potting rubber can easily select removal, repair, or complete replacement, and re-injecting new potting rubber in the repair site.

When the silicone elastomer is removed, the unwanted material can be torn or removed from the area to be repaired using a sharp blade or a knife. For elastomers adhered to the portion, it is preferable to remove the substrate or circuit using a mechanical method such as scraping or friction.

Before reperfuse the potchic adhesive, it is necessary to use a sandpaper to fill the surface of the cured pottex, and then wipe with a suitable solvent. This helps to enhance the adhesion, combining the repaired materials with existing pottings.

 

6. Operational precautions

1.a, b Components must be stirred after 2-5 minutes after opening the original package, avoiding the effects of product effects due to the layered precipitation caused during transportation and storage.

2. When mixing, consolidate agitation, especially the stirring;

 

Storage and validity

When there is no open seal below 25 ° C, the product from the date of production is 6 months. If it is overdue, it can be used normally after test inspection.

 

Packaging specifications

AB 20kg / barrel


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 Company: Shenzhen Deemno Technology Co., Ltd.  
Address: Xinjincheng Industrial Park, New Village, Dalang Street, Longhua District, Shenzhen  
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