Maken this problem to analyze from the source, thermally conductive silicone-added interface thermally conductive materials, generally used on the back of the CPU and the heat sink, the action is to extrude the air in the gap, so the heat-conductive silicone is not coated. Ok, not the thinner, the better, and the thickness is not the consensus, but it is necessary to determine the actual situation, but the principle is to ensure that the air is clean, the thinner, the better, the better.